Xianyi Products
Solder Balls
AuSn solder ball is mainly used in the field of microelectronics packaging such as BGA,CSP,SIP,flip chip,stacked chip and so on.Our Au80Sn20 solder balls have small and precise size with a minimum diameter of φ50μm.
Features
lHigh oxidation resistance
lPrecise size
Specifications
Content | Au80Sn20, Au78Sn22 |
Melting Temperature (℃) | 280 |
Sphere Diameter | φ50-1500μm |
Other diameters can also be customized as needed.
